Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040176 | Technologies for high aspect ratio carbon etching with inserted charge dissipation layer | Andrew Metz, Yun Han, Minjoon Park, Ya-Ming Chen | 2024-07-16 |
| 12009211 | Method for highly anisotropic etching of titanium oxide spacer using selective top-deposition | Ya-Ming Chen, Katie Lutker-Lee, Eric Chih-Fang Liu, Angelique Raley, Stephanie Oyola-Reynoso | 2024-06-11 |