Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040176 | Technologies for high aspect ratio carbon etching with inserted charge dissipation layer | Shihsheng Chang, Andrew Metz, Yun Han, Ya-Ming Chen | 2024-07-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040176 | Technologies for high aspect ratio carbon etching with inserted charge dissipation layer | Shihsheng Chang, Andrew Metz, Yun Han, Ya-Ming Chen | 2024-07-16 |