Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183629 | Selective hybrid capping layer for metal gates of transistors | Chung-Chiang Wu, Po-Cheng Chen, Kuo-Chan Huang, Pin-Hsuan Yeh, Hsien-Ming Lee +2 more | 2024-12-31 |
| 12142531 | Pre-deposition treatment for FET technology and devices formed thereby | Cheng-Yen Tsai, Chung-Chiang Wu, Tai-Wei Hwang, Hung-Chin Chung, Da-Yuan Lee +3 more | 2024-11-12 |
| 12100751 | Void elimination for gap-filling in high-aspect ratio trenches | Chih-Hsiang Fan, Tsung-Han Shen, Jia-Ming Lin, Hsien-Ming Lee, Chi On Chui | 2024-09-24 |
| 12087637 | Semiconductor device and method of manufacture | Chung-Chiang Wu, Hsin-Han Tsai, Chia-Ching Lee, Hung-Chin Chung, Cheng-Lung Hung +1 more | 2024-09-10 |
| 11935957 | Geometry for threshold voltage tuning on semiconductor device | Chung-Chiang Wu, Shih-Hang Chiu, Chia-Ching Lee, Hsueh Wen Tsau, Cheng-Yen Tsai +3 more | 2024-03-19 |