Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100751 | Void elimination for gap-filling in high-aspect ratio trenches | Chih-Hsiang Fan, Jia-Ming Lin, Wei-Chin Lee, Hsien-Ming Lee, Chi On Chui | 2024-09-24 |
TS
Tsung-Han Shen
Overall (2024): #233,954 of 561,600Top 45%
1
Patents 2024