JL

Jia-Ming Lin

TSMC: 2 patents #1,566 of 4,162Top 40%
Overall (2024): #153,890 of 561,600Top 30%
2
Patents 2024

Issued Patents 2024

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12100751 Void elimination for gap-filling in high-aspect ratio trenches Chih-Hsiang Fan, Tsung-Han Shen, Wei-Chin Lee, Hsien-Ming Lee, Chi On Chui 2024-09-24
11967504 Gate structures in transistor devices and methods of forming same Hsin-Yi Lee, Kun-Yu Lee, Chi On Chui 2024-04-23