Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100751 | Void elimination for gap-filling in high-aspect ratio trenches | Tsung-Han Shen, Jia-Ming Lin, Wei-Chin Lee, Hsien-Ming Lee, Chi On Chui | 2024-09-24 |
| 11961768 | CMOS FinFET structures including work-function materials having different proportions of crystalline orientations and methods of forming the same | Ya-Wen Chiu, Da-Yuan Lee, Hsien-Ming Lee, Kai-Cyuan Yang, Yu-Sheng Wang +1 more | 2024-04-16 |