Issued Patents 2024
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901396 | Back side illuminated image sensor with reduced sidewall-induced leakage | Shuang-Ji Tsai, Jen-Cheng Liu, Wen-De Wang, Hsiao-Hui Tseng | 2024-02-13 |
| 11901388 | Device over photodetector pixel sensor | Jhy-Jyi Sze, Alexander Kalnitsky | 2024-02-13 |
| 11894410 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2024-02-06 |