Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183793 | Method for forming semiconductor device structure with metal-semiconductor compound layer | Gulbagh Singh, Cheng-Yeh Huang, Chin-Nan Chang, Chih-Ming Lee | 2024-12-31 |
| 12052851 | Integrated circuit structure for low power SRAM | Gulbagh Singh, Shun-Chi TSAI, Chih-Ming Lee, Kuo-Hung Lo | 2024-07-30 |
| 12043770 | Temporary bonding composition, temporary bonding film, composite film, temporary bonding method and semiconductor wafer package | Cheng-Wei Lee, Pei-Ci Cho, Chun-Hung Huang, Min-Chi Yang, Yuan-Li Liao | 2024-07-23 |