Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12043770 | Temporary bonding composition, temporary bonding film, composite film, temporary bonding method and semiconductor wafer package | Cheng-Wei Lee, Pei-Ci Cho, Chun-Hung Huang, Min-Chi Yang, Chi-Yen Lin | 2024-07-23 |
| 11976018 | Diamine compound, method for manufacturing the same, and applications thereof | Kai-Sheng Jeng, You-Ming Chen, Yu-Ying Kuo, Shao-Chi Cheng | 2024-05-07 |