Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12043770 | Temporary bonding composition, temporary bonding film, composite film, temporary bonding method and semiconductor wafer package | Cheng-Wei Lee, Chun-Hung Huang, Min-Chi Yang, Chi-Yen Lin, Yuan-Li Liao | 2024-07-23 |