Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12043770 | Temporary bonding composition, temporary bonding film, composite film, temporary bonding method and semiconductor wafer package | Cheng-Wei Lee, Pei-Ci Cho, Min-Chi Yang, Chi-Yen Lin, Yuan-Li Liao | 2024-07-23 |
| 11947090 | Lens module | Chun-Yu Hsueh, Tsung-Tse Chen | 2024-04-02 |