Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183793 | Method for forming semiconductor device structure with metal-semiconductor compound layer | Cheng-Yeh Huang, Chin-Nan Chang, Chih-Ming Lee, Chi-Yen Lin | 2024-12-31 |
| 12052851 | Integrated circuit structure for low power SRAM | Shun-Chi TSAI, Chih-Ming Lee, Chi-Yen Lin, Kuo-Hung Lo | 2024-07-30 |
| 12027581 | Semiconductor device with air-void in spacer | Kun-Tsang Chuang, Hsin-Chi Chen | 2024-07-02 |
| 11942547 | Source/drain epitaxial layer profile | Hsin-Chi Chen, Kun-Tsang Chuang | 2024-03-26 |
| 11935895 | Semiconductor device structure and methods of forming the same | Tsung-Han Tsai | 2024-03-19 |
| 11887987 | Semiconductor wafer with devices having different top layer thicknesses | Kuan-Liang Liu, Wang Po-Jen, Kun-Tsang Chuang, Hsin-Chi Chen | 2024-01-30 |