Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887987 | Semiconductor wafer with devices having different top layer thicknesses | Gulbagh Singh, Kuan-Liang Liu, Kun-Tsang Chuang, Hsin-Chi Chen | 2024-01-30 |
WP
Wang Po-Jen
Overall (2024): #226,063 of 561,600Top 45%
1
Patents 2024