Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183793 | Method for forming semiconductor device structure with metal-semiconductor compound layer | Gulbagh Singh, Cheng-Yeh Huang, Chih-Ming Lee, Chi-Yen Lin | 2024-12-31 |
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Chin-Nan Chang
Overall (2024): #515,635 of 561,600Top 95%
1
Patents 2024