Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046581 | Integrated circuit package with glass spacer | Mao Guo, Yong She, Sireesha Gogineni | 2024-07-23 |
| 11990449 | Dual RDL stacked die package using vertical wire | — | 2024-05-21 |
| 11948917 | Die over mold stacked semiconductor package | Florence R. Pon, Yi Xu, James Zhang, Yuhong Cai, Tyler Leuten +1 more | 2024-04-02 |