Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046581 | Integrated circuit package with glass spacer | Mao Guo, Hyoung Il Kim, Yong She | 2024-07-23 |
| 11881441 | Stacked die semiconductor package spacer die | Andrew Tae Kim, Yong She, Karissa J. Blue | 2024-01-23 |