Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046581 | Integrated circuit package with glass spacer | Mao Guo, Hyoung Il Kim, Sireesha Gogineni | 2024-07-23 |
| 12027496 | Film in substrate for releasing z stack-up constraint | Jianfeng Hu, Zhicheng Ding, Zhijun Xu | 2024-07-02 |
| 11990395 | Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancement | Xiaoying Tang, Zhicheng Ding, Bin Liu, Zhijun Xu | 2024-05-21 |
| 11894344 | Power enhanced stacked chip scale package solution with integrated die attach film | Zhijun Xu, Bin Liu, Zhicheng Ding | 2024-02-06 |
| 11881441 | Stacked die semiconductor package spacer die | Sireesha Gogineni, Andrew Tae Kim, Karissa J. Blue | 2024-01-23 |