Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990395 | Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancement | Zhicheng Ding, Bin Liu, Yong She, Zhijun Xu | 2024-05-21 |