Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027496 | Film in substrate for releasing z stack-up constraint | Jianfeng Hu, Yong She, Zhijun Xu | 2024-07-02 |
| 11990395 | Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancement | Xiaoying Tang, Bin Liu, Yong She, Zhijun Xu | 2024-05-21 |
| 11894344 | Power enhanced stacked chip scale package solution with integrated die attach film | Zhijun Xu, Bin Liu, Yong She | 2024-02-06 |