Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948917 | Die over mold stacked semiconductor package | Florence R. Pon, James Zhang, Yuhong Cai, Tyler Leuten, William T. Glennan +1 more | 2024-04-02 |
| 11901264 | Choked flow cooling | Mark Forsnes, Yuhong Cai, Florence R. Pon | 2024-02-13 |
| 11894334 | Dual head capillary design for vertical wire bond | Yuhong Cai, Bilal Khalaf | 2024-02-06 |