WG

William T. Glennan

IN Intel: 1 patents #1,727 of 4,430Top 40%
📍 Folsom, CA: #124 of 249 inventorsTop 50%
🗺 California: #26,178 of 67,048 inventorsTop 40%
Overall (2024): #222,042 of 561,600Top 40%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11948917 Die over mold stacked semiconductor package Florence R. Pon, Yi Xu, James Zhang, Yuhong Cai, Tyler Leuten +1 more 2024-04-02