Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948917 | Die over mold stacked semiconductor package | Florence R. Pon, Yi Xu, Yuhong Cai, Tyler Leuten, William T. Glennan +1 more | 2024-04-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948917 | Die over mold stacked semiconductor package | Florence R. Pon, Yi Xu, Yuhong Cai, Tyler Leuten, William T. Glennan +1 more | 2024-04-02 |