Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12096566 | Reciprocal PCB manufacturing process | — | 2024-09-17 |
| 11948917 | Die over mold stacked semiconductor package | Florence R. Pon, Yi Xu, James Zhang, Yuhong Cai, William T. Glennan +1 more | 2024-04-02 |