Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165902 | Substrate bonding apparatus and substrate bonding method | Hajime MITSUISHI, Isao Sugaya, Atsushi Kamashita, Masashi Okada, Hidehiro Maeda | 2024-12-10 |
| 12100667 | Apparatus for stacking substrates and method for the same | Isao Sugaya, Kazuya Okamoto, Hajime MITSUISHI | 2024-09-24 |
| 12080554 | Bonding method, bonding device, and holding member | Hajime MITSUISHI, Isao Sugaya, Masaki Tsunoda, Hidehiro Maeda, Ikuhiro Kuwano | 2024-09-03 |