Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080554 | Bonding method, bonding device, and holding member | Hajime MITSUISHI, Isao Sugaya, Minoru Fukuda, Masaki Tsunoda, Hidehiro Maeda | 2024-09-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080554 | Bonding method, bonding device, and holding member | Hajime MITSUISHI, Isao Sugaya, Minoru Fukuda, Masaki Tsunoda, Hidehiro Maeda | 2024-09-03 |