Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165902 | Substrate bonding apparatus and substrate bonding method | Hajime MITSUISHI, Isao Sugaya, Atsushi Kamashita, Masashi Okada, Minoru Fukuda | 2024-12-10 |
| 12080554 | Bonding method, bonding device, and holding member | Hajime MITSUISHI, Isao Sugaya, Minoru Fukuda, Masaki Tsunoda, Ikuhiro Kuwano | 2024-09-03 |