Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165902 | Substrate bonding apparatus and substrate bonding method | Hajime MITSUISHI, Isao Sugaya, Atsushi Kamashita, Minoru Fukuda, Hidehiro Maeda | 2024-12-10 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165902 | Substrate bonding apparatus and substrate bonding method | Hajime MITSUISHI, Isao Sugaya, Atsushi Kamashita, Minoru Fukuda, Hidehiro Maeda | 2024-12-10 |