Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165902 | Substrate bonding apparatus and substrate bonding method | Hajime MITSUISHI, Atsushi Kamashita, Masashi Okada, Minoru Fukuda, Hidehiro Maeda | 2024-12-10 |
| 12107068 | Method and device for manufacturing stacked substrate | Hajime MITSUISHI | 2024-10-01 |
| 12100667 | Apparatus for stacking substrates and method for the same | Kazuya Okamoto, Hajime MITSUISHI, Minoru Fukuda | 2024-09-24 |
| 12080554 | Bonding method, bonding device, and holding member | Hajime MITSUISHI, Minoru Fukuda, Masaki Tsunoda, Hidehiro Maeda, Ikuhiro Kuwano | 2024-09-03 |