Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080554 | Bonding method, bonding device, and holding member | Hajime MITSUISHI, Isao Sugaya, Minoru Fukuda, Hidehiro Maeda, Ikuhiro Kuwano | 2024-09-03 |
| 12032331 | Electroconductive member, process cartridge, and electrophotographic image forming apparatus | Atsushi Uematsu, Yuichi Kikuchi, Masatsugu Hongo, Mototeru Goto, NAO HIGUCHI | 2024-07-09 |