Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12172240 | Solder particles | Kunihiko Akai, Yuuhei Okada, Toshimitsu MORIYA, Shinichirou Sukata, Masayuki Miyaji | 2024-12-24 |
| 12100923 | Connection structure and manufacturing method therefor | Kunihiko Akai, Masayuki Miyaji, Junichi KAKEHATA, Toshimitsu MORIYA | 2024-09-24 |
| 12070800 | Electronic component and method for manufacturing electronic component | Shinichirou Sukata, Masaya TOBA, Hideo Nakako, Yuki KAWANA, Kosuke URASHIMA +5 more | 2024-08-27 |
| 11990396 | Substrate and method for manufacturing the same | Kazuyuki MITSUKURA, Masaya TOBA, Kazuhiko Kurafuchi | 2024-05-21 |
| 11890681 | Method for producing bonded object and semiconductor device and copper bonding paste | Yuki KAWANA, Hideo Nakako, Motohiro NEGISHI, Chie Sugama, Yuichi Yanaka | 2024-02-06 |
| 11887960 | Member connection method | Motohiro NEGISHI, Hideo Nakako, Yuki KAWANA, Dai Ishikawa, Chie Sugama | 2024-01-30 |