Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12114437 | Wiring structure, method for manufacturing same, and semiconductor package | Masaya TOBA | 2024-10-08 |
| 12004305 | Wiring board and production method for same | Masaya TOBA, Kazuhiko Kurafuchi, Takashi Masuko, Shinichiro Abe | 2024-06-04 |
| 11990396 | Substrate and method for manufacturing the same | Masaya TOBA, Yoshinori Ejiri, Kazuhiko Kurafuchi | 2024-05-21 |
| 11979990 | Wiring board and method for manufacturing the same | Masaya TOBA, Kazuhiko Kurafuchi, Takashi Masuko, Shinichiro Abe | 2024-05-07 |