Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12114437 | Wiring structure, method for manufacturing same, and semiconductor package | Kazuyuki MITSUKURA | 2024-10-08 |
| 12070800 | Electronic component and method for manufacturing electronic component | Yoshinori Ejiri, Shinichirou Sukata, Hideo Nakako, Yuki KAWANA, Kosuke URASHIMA +5 more | 2024-08-27 |
| 12004305 | Wiring board and production method for same | Kazuhiko Kurafuchi, Takashi Masuko, Kazuyuki MITSUKURA, Shinichiro Abe | 2024-06-04 |
| 11990396 | Substrate and method for manufacturing the same | Kazuyuki MITSUKURA, Yoshinori Ejiri, Kazuhiko Kurafuchi | 2024-05-21 |
| 11979990 | Wiring board and method for manufacturing the same | Kazuhiko Kurafuchi, Takashi Masuko, Kazuyuki MITSUKURA, Shinichiro Abe | 2024-05-07 |