Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12070800 | Electronic component and method for manufacturing electronic component | Yoshinori Ejiri, Shinichirou Sukata, Masaya TOBA, Yuki KAWANA, Kosuke URASHIMA +5 more | 2024-08-27 |
| 11890681 | Method for producing bonded object and semiconductor device and copper bonding paste | Yuki KAWANA, Motohiro NEGISHI, Chie Sugama, Yoshinori Ejiri, Yuichi Yanaka | 2024-02-06 |
| 11887960 | Member connection method | Motohiro NEGISHI, Yuki KAWANA, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2024-01-30 |