Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11890681 | Method for producing bonded object and semiconductor device and copper bonding paste | Yuki KAWANA, Hideo Nakako, Chie Sugama, Yoshinori Ejiri, Yuichi Yanaka | 2024-02-06 |
| 11887960 | Member connection method | Hideo Nakako, Yuki KAWANA, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2024-01-30 |