Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12172240 | Solder particles | Kunihiko Akai, Yoshinori Ejiri, Yuuhei Okada, Toshimitsu MORIYA, Shinichirou Sukata | 2024-12-24 |
| 12100923 | Connection structure and manufacturing method therefor | Kunihiko Akai, Junichi KAKEHATA, Yoshinori Ejiri, Toshimitsu MORIYA | 2024-09-24 |