Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136759 | Antenna-in-package devices and methods of making | KyoungHee Park, Kyunghwan KIM, Seunghyun Lee, Sangjun Park | 2024-11-05 |
| 12046564 | Method and device for reducing metal burrs when sawing semiconductor packages | DeokKyung Yang, HeeSoo Lee | 2024-07-23 |
| 11990424 | Selective EMI shielding using preformed mask | Kyunghwan KIM, HeeSoo Lee, ChangOh Kim, KyoungHee Park, JinHee Jung +3 more | 2024-05-21 |
| 11935777 | Semiconductor manufacturing equipment and method of providing support base with filling material disposed into openings in semiconductor wafer for support | HyeonChul LEE, HyunSu TAK, Wanil Lee, InHo SEO | 2024-03-19 |
| 11932933 | Cooling device and process for cooling double-sided SiP devices during sputtering | OhHan Kim, Sell Jung, HeeSoo Lee | 2024-03-19 |
| 11894314 | Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation | Gwang Kim, Junho Ye, YouJoung Choi, Minkyung Kim, YongWoo Lee +1 more | 2024-02-06 |
| 11887863 | Double-sided partial molded SIP module | Gwang Kim, Junho Ye | 2024-01-30 |