DY

DeokKyung Yang

SC Stats Chippac: 1 patents #24 of 65Top 40%
📍 Buk-ri, KR: #1 of 3 inventorsTop 35%
Overall (2024): #486,008 of 561,600Top 90%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12046564 Method and device for reducing metal burrs when sawing semiconductor packages HunTeak Lee, HeeSoo Lee 2024-07-23