Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935777 | Semiconductor manufacturing equipment and method of providing support base with filling material disposed into openings in semiconductor wafer for support | HyeonChul LEE, HunTeak Lee, HyunSu TAK, Wanil Lee | 2024-03-19 |