HL

HyeonChul LEE

SC Stats Chippac: 1 patents #24 of 65Top 40%
Overall (2024): #437,328 of 561,600Top 80%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11935777 Semiconductor manufacturing equipment and method of providing support base with filling material disposed into openings in semiconductor wafer for support HunTeak Lee, HyunSu TAK, Wanil Lee, InHo SEO 2024-03-19