Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11894314 | Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation | HunTeak Lee, Gwang Kim, Junho Ye, Minkyung Kim, YongWoo Lee +1 more | 2024-02-06 |