Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11894314 | Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation | HunTeak Lee, Junho Ye, YouJoung Choi, Minkyung Kim, YongWoo Lee +1 more | 2024-02-06 |
| 11887863 | Double-sided partial molded SIP module | HunTeak Lee, Junho Ye | 2024-01-30 |