Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087679 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more | 2024-09-10 |
| 11935770 | Modular mainframe layout for supporting multiple semiconductor process modules or chambers | Randy Harris, Coby Scott GROVE, Paul Z. Wirth, Avinash SHANTARAM, Alpay Yilmaz +1 more | 2024-03-19 |
| 11935771 | Modular mainframe layout for supporting multiple semiconductor process modules or chambers | Randy Harris, Coby Scott GROVE, Paul Z. Wirth, Avinash SHANTARAM, Alpay Yilmaz +3 more | 2024-03-19 |
| 11887934 | Package structure and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +1 more | 2024-01-30 |
| 11881447 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more | 2024-01-23 |
| 11862546 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +2 more | 2024-01-02 |