Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984335 | FOUP or cassette storage for hybrid substrate bonding system | Coby Scott GROVE, Ruiping Wang, Jitendra Ratilal BHIMJIYANI | 2024-05-14 |
| 11935770 | Modular mainframe layout for supporting multiple semiconductor process modules or chambers | Randy Harris, Coby Scott GROVE, Paul Z. Wirth, Alpay Yilmaz, Amir NISSAN +1 more | 2024-03-19 |
| 11935771 | Modular mainframe layout for supporting multiple semiconductor process modules or chambers | Randy Harris, Coby Scott GROVE, Paul Z. Wirth, Alpay Yilmaz, Amir NISSAN +3 more | 2024-03-19 |