Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984335 | FOUP or cassette storage for hybrid substrate bonding system | Coby Scott GROVE, Ruiping Wang, Avinash SHANTARAM | 2024-05-14 |
| 11935771 | Modular mainframe layout for supporting multiple semiconductor process modules or chambers | Randy Harris, Coby Scott GROVE, Paul Z. Wirth, Avinash SHANTARAM, Alpay Yilmaz +3 more | 2024-03-19 |