Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183594 | Semiconductor device with tiered pillar and manufacturing method thereof | Michael Kelly, Curtis Zwenger | 2024-12-31 |
| 12159823 | Semiconductor package with front side and back side redistribution structures and fabricating method thereof | Michael Kelly, David Jon Hiner, Roger D. St. Amand | 2024-12-03 |
| 12136565 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Won Chul Do, David Jon Hiner | 2024-11-05 |
| 11915949 | Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby | Bora Baloglu, Suresh Jayaraman, Andre Cardoso, Eoin O'Toole, Marta Sa Santos +4 more | 2024-02-27 |
| 11901335 | Semiconductor package with routing patch and conductive interconnection structures laterally displaced from routing patch | Michael Kelly, David Jon Hiner | 2024-02-13 |
| 11881471 | Semiconductor device and manufacturing method thereof | — | 2024-01-23 |