Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183594 | Semiconductor device with tiered pillar and manufacturing method thereof | Ronald Patrick Huemoeller, Michael Kelly | 2024-12-31 |
| 12035472 | Stackable via package and method | Akito Yoshida, Mahmoud Dreiza | 2024-07-09 |
| 12015000 | Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof | Bora Baloglu, Ron Huemoeller | 2024-06-18 |
| 11948808 | Semiconductor device and manufacturing method thereof | Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki +6 more | 2024-04-02 |
| 11942581 | Semiconductor device with transmissive layer and manufacturing method thereof | David Clark | 2024-03-26 |
| 11901343 | Semiconductor device with integrated heat distribution and manufacturing method thereof | Bora Baloglu, Ron Huemoeller | 2024-02-13 |