Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136565 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Ronald Patrick Huemoeller, David Jon Hiner | 2024-11-05 |
| 12080682 | Semiconductor devices and methods of manufacturing semiconductor devices | Yi Seul Han, Tae Yong Lee, Ji Yeon Ryu, Jin Young Khim, Shaun Bowers +1 more | 2024-09-03 |
| 12033970 | Semiconductor device and manufacturing method thereof | Jae Hun Bae, Min Yoo, Young Rae Kim, Min Hwa Chang, Dong Hyun Kim +2 more | 2024-07-09 |
| 11990411 | Device chip scale package including a protective layer | Tae Ki Kim, Jae Beom Shim, Seung Nam Son | 2024-05-21 |
| 11948808 | Semiconductor device and manufacturing method thereof | Dong Jin Kim, Jin Han Kim, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han +6 more | 2024-04-02 |
| 11881458 | Semiconductor devices and methods of manufacturing semiconductor devices | Jin Young Khim, Sang Hyoun Lee, Ji Hun Yi, Ji Yeon Ryu | 2024-01-23 |