Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990411 | Device chip scale package including a protective layer | Tae Ki Kim, Jae Beom Shim, Won Chul Do | 2024-05-21 |
| 11948808 | Semiconductor device and manufacturing method thereof | Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki +6 more | 2024-04-02 |
| 11908761 | Electronic devices with a redistribution layer and methods of manufacturing electronic devices with a redistribution layer | Dong Hyun Khim, Jin Kun Yoo | 2024-02-20 |