Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990411 | Device chip scale package including a protective layer | Tae Ki Kim, Seung Nam Son, Won Chul Do | 2024-05-21 |
| 11978687 | Semiconductor device and method of manufacturing a semiconductor device | Kyeong Tae Kim, Yi Seul Han, Tae Yong Lee | 2024-05-07 |