Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159823 | Semiconductor package with front side and back side redistribution structures and fabricating method thereof | Michael Kelly, Ronald Patrick Huemoeller, Roger D. St. Amand | 2024-12-03 |
| 12136565 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Ronald Patrick Huemoeller, Won Chul Do | 2024-11-05 |
| 11901335 | Semiconductor package with routing patch and conductive interconnection structures laterally displaced from routing patch | Michael Kelly, Ronald Patrick Huemoeller | 2024-02-13 |